Precision machining in the semiconductor field is a very important technology, because semiconductor process technology is the main development basis of modern technology. Precision machining in the semiconductor field is not just the completion of processing, but the completion of the complete cycle of the entire production. According to different correspondences of different technologies, it can be divided into the following categories:

* Material preparation: including the elemental composition and concentration of the material itself, as well as the adjustment of the structure and properties of the material;

* Processing: including rough processing, fine processing, surface treatment, etc.;

* System integration: including encapsulation, optical fiber transmission system encapsulation, etc.;

* Evaluation and testing: including semiconductor performance testing, etc.;

* Adjustment and control: It mainly uses semiconductor technology to adjust the parameters in processing to control and maintain its precision.

Precision processing in the semiconductor field requires precision in every step of the processing process, so there are strict requirements for technicians and processing equipment. Considering the asymmetry between technology and equipment, the assistance of experts is even required in some aspects in the processing of more complex components.

The importance of precision machining in the semiconductor field is also very important to ensure the quality of technological products. The importance of precision machining lies in: it can ensure the processing accuracy of the product, and maintain the precision of the product's surface flatness and various dimensions; it can ensure the wafer functionality of multiple products, thereby ensuring the safety and reliability of the product It can ensure the safety and qualification of the entire processing equipment; it can fundamentally ensure the qualification of the post-wafer manufacturing process; it can also ensure the quality stability and reliability of the product.

However, in reality, in the face of rapidly changing semiconductor technology, precision processing still faces many challenges and difficulties, including: complex processing process, imperfect preparation and acceptance technology, accuracy of equipment and technology, etc. Therefore, in order to ensure the reliability of production, effective technical measures must be taken in the process of precision machining, including: strengthening the skills of skilled workers, implementing quality management, and adopting advanced processing equipment and consumables. At the technical level, it is necessary to improve the precision of materials and processes, to develop processing methods that meet the specifications for multi-level and multi-functional wafer processing technologies, and to make full use of advanced testing equipment to control the accuracy of the process.